TCI Engineering

Project Overview

TCI Engineering designed and implemented a fully automated wafer loading and unloading system to enhance production capacity, streamline operations, and meet stringent European safety standards. Tailored for precision laser machining, the system enables cassette handling of up to 25 wafers, fully eliminating manual intervention and improving process reliability.

The project scope included CE certification, operator training, and a comprehensive maintenance plan with 24-hour support to ensure continuous, safe operation. Seamlessly integrated into the production line, the system supports 24/7 manufacturing, significantly boosting efficiency and establishing a strong foundation for long-term innovation and operational excellence.

Final Solution

TCI Engineering delivered a fully integrated wafer handling automation system designed for seamless performance in precision laser machining. The system handles up to 25 wafers per cassette, ensuring accurate positioning, smooth transfer, and continuous operation without manual intervention.

Engineered and built in-house, the solution combines mechanical precision, intelligent control software, and strict safety compliance under CE certification. It was adapted to support new bagging requirements, reflecting flexibility for evolving production needs. Following installation, operator and technician training ensured immediate usability, while final validation confirmed full production readiness and long-term reliability.

Final Result

The automated solution transformed production capabilities:


This project marked a major advancement in production efficiency and future-readiness for the business.